April 15, 2022

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If you need to avoid baking your surface mount devices (SMD) before solder reflow, storing them in proper dry packaging will be required.  A dry package typically consists of three components; an MBB, desiccant, and humidity indicator card (HIC).  To determine how dry the package should be, you need to determine your MSL (moisture sensitivity…

Read more Creating a Dry ESD Package