Lots of end users tell us that rarely, if ever do they connect an ESD event to a failed product. But almost always, end users are not willing to invest the time in investigating the root cause of their product failure to determine if it was an ESD event or not. Most of the time failure is caulked up to “defective component” or “dead board”, the product is scraped, and manufacturing continues. So long as yields from production stay consistent and there is no increase in the amounts of returned product, additional time to determine the root cause of the failure is not needed. As this blog post from Chip Overclock notes:
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So how many product failures are due to ESD damage? Nobody ever really knows, but we have been told that about 50% of non-physical damage product failures in particular industries are due to ESD events. This number seems to work for most electronics manufacturers that we work with. Thanks to Chip Overclock for taking the time to get us a little closer to knowing how many product failures are due to ESD damage.